Foam Hot Melt Applicator 'Micron + FOAM'
50% reduction in adhesive consumption! A hot melt applicator that also contributes to saving electricity costs! Usable with reactive hot melt adhesives! No nitrogen required!
"Micron+ FOAM" is a hot melt applicator that reduces adhesive consumption by foaming the adhesive. By mixing dry air (no nitrogen required) with the melted hot melt adhesive in the tank, the hot melt is foamed. This foaming increases the adhesive volume, enhancing insulation and vibration effects. 【Features】 ■ Potential to reduce energy consumption by approximately 60% (according to MELER in Spain) ■ Adhesive consumption reduced by up to 50% ■ Increased adhesive volume (improved contact) ■ Enhanced insulation effect ■ Improved vibration effect ■ Improved thixotropic properties *For more details, please download the PDF or feel free to contact us.
- 企業：ファスト
- 価格：Other
